Multichip module substrates

被引：0

作者：

Blum, NA ^{[1
]}

Charles, HK ^{[1
]}

Francomacaro, AS ^{[1
]}

机构：

[1] Johns Hopkins Univ, Appl Phys Lab, Tech Serv Dept, Elect Serv Grp, Laurel, MD 20723 USA

来源：

JOHNS HOPKINS APL TECHNICAL DIGEST | 1999年 / 20卷 / 01期

关键词：

electronic packaging; multichip modules; substrates; thin films;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The three major technologies used to fabricate substrates for multichip modules (MCMs) are described. These are MCM-L, composed of metal traces on stacked organic laminate sheets; MCM-C, metal patterned and interconnected on co-fired ceramic layers; and MCM-D, vapor-deposited, patterned metal layers alternating sequentially with spun-on or vapor-deposited dielectric thin films. Examples of circuits fabricated at APL using each of these MCM technologies are presented.

引用

页码：62 / 69

页数：8

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