Influence of zincating morphology on quality of electroless nickel bumping

被引：0
|
作者：
Qi, GJ [1 ]
Fokkink, LGJ [1 ]
Chew, KH [1 ]
机构：
[1] Gint Inst Mfg Technol, Singapore, Singapore
来源：
ELECTRONICS GOES GREEN 2000 (PLUS): A CHALLENGE FOR THE NEXT MILLENNIUM, VOL 1, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
This work relates to the electroless nickel (EN) metallization and bumping processes for flip chip packaging applications. Zincating of the aluminum bond pads is an essential process step, activating the pads for EN deposition and ensuring good adhesion between the pad and the bump. Different zinc layer morphologies in terms of grain size or smoothness are reproducibly prepared by varying the zincating process parameters and chemical conditions. Quantitative correlations between the zinc layer morphology and the bump characteristics have been established.
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页码：99 / 102
页数：4
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