The thermal conductivity of LED under the influence of vacuum sputtering films

被引:3
|
作者
Hsu, Ming-Seng [1 ]
Chang, Chung-Chih [1 ]
Wang, Yau-Chyr [2 ]
机构
[1] Chinese Mil Acad, Dept Phys, Feng Shan Kaohsiung 830, Taiwan
[2] Neo Zeon Inst Technol Taiwan, Dept Comp Sci & Informat Engn, Taipei, Taiwan
来源
PHOTONIC FIBER AND CRYSTAL DEVICES: ADVANCES IN MATERIALS AND INNOVATIONS IN DEVICE APPLICATIONS IV | 2010年 / 7781卷
关键词
High brightness light emitting diode; printed circuit board; thermal resistance; vacuum sputtering; PACKAGE;
D O I
10.1117/12.859852
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The thermal conductivity has the important influence in quantum effect of light emitting diodes (LED) especially in high brightness light emitting diodes (HB LED). One of the biggest challenges is efficient heat transfer from PCB to aluminum plate when it base on printed circuit board (PCB). Because it enables transfer the heat from electric device to the aluminum plate, which completely removes the heat. In this study, alumina (Al2O3), alumina nitride (AlN) and zinc sulfide (ZnS) films soldered the HB LED lamps to enhance the heat transfer. All of the films were fabricated onto 1070 aluminum substrate by vacuum sputtering technology. The dielectric coatings were characterized by several subsequent analyses, especially the measurement of thermal resistance. The X-Ray diffraction (XRD) diagram analysis reveals three kinds of ceramic thin films were successfully grown on the individual substrate. Moreover, the alumina nitride coating has low sheet resistivity, high hardness, high critical load, and good thermal conduction, 200 W/m-K, as compared to those of Al2O3 and ZnS films.
引用
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页数:5
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