Optical interconnects for board level applications

被引：3

作者：

Dangel, R. ^{[1
]}

Beyeler, R. ^{[1
]}

Meier, N. ^{[1
]}

Lamprecht, T. ^{[1
]}

Horst, F. ^{[1
]}

Jubin, D. ^{[1
]}

Weiss, J. ^{[1
]}

Offrein, B. J. ^{[1
]}

机构：

[1] IBM Res GmbH, Zurich Res Lab, CH-8803 Ruschlikon, Switzerland

来源：

OPTOELECTRONIC INTEGRATED CIRCUITS XI | 2009年 / 7219卷

关键词：

Optical interconnects; optical packaging; polymer waveguides;

D O I：

10.1117/12.811128

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Optical link technology will play an increasingly important role for board-level interconnects in servers and supercomputers as a means to keep pace with the increasing intra-system bandwidth requirements. Low-cost and high density optical packaging concepts are required. We describe the development of board-level interconnects based on polymer waveguide technology. In this paper, we focus on flexible optical waveguide sheets and the passive alignment of optical connectors.

引用

页数：7

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