Molecular Dynamics Simulation of the Edge Dislocation Glide in Nickel and Silver in the Presence of Interstitial Light Element Atoms

The edge dislocation glide velocity in fcc metals (nickel, silver) is studied at various temperatures, tangential stresses, and contents of interstitial atoms of light elements (carbon, nitrogen, oxygen) by molecular dynamics simulation. The glide velocity of partial dislocations in pure metals decreases with increasing temperature at low tangential stresses (similar to 10 MPa) and increases at relatively high tangential stresses (similar to 10(2) MPa or higher). The introduction of interstitial atoms retards dislocation glide. This effect is more pronounced in nickel than in silver, which is mainly due to the difference in the lattice parameters: the lattice parameter of nickel is smaller than that of silver.