ADVANCED PROCESS CONTROL APPLICATIONS FOR ADVANCED CMP PROCESS

被引：0
|
作者：
Yang, Jun [1 ]
Lin, Yi Shih [1 ]
Yang, SiYuan Frank [1 ]
Huang, Yi [1 ]
Shao, Qun [1 ]
Liu, Hongtao [1 ]
机构：
[1] Semicond Mfg Int Shanghai Corp, Shanghai 201203, Peoples R China
来源：
2015 China Semiconductor Technology International Conference | 2015年
关键词：
advanced process control; chemical mechanical polishing; profile control; run to run control; partition; safety guarding features;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
There are increasing new needs for advanced process control (APC) from chemical mechanical polishing (CMP) process along with the technology nodes advancing to 28nm and below. Besides traditional applications for wafer to wafer and batch to batch thickness variation reduction, and feed-forward based on incoming thickness/depth, the other new needs include within wafer uniformity control based on consumable counts and incoming profile, preventing polishing rate from dropping due to disk and pad deteriorating etc. This paper discusses those APC applications for CMP processes and along with important features which advanced APC software should equip with.
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页数：3
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