A High-Temperature Digital Image Correlation Method and its Application on Strain Measurement of Film Cooling Holes

In this paper, a digital image correlation (DIC) method is developed and applied on film cooling holes in the submillimeter scale in high temperature. Compared with the traditional DIC method, the speckle patterning method and the optical system are improved. In detail, a kind of high temperature-resistant black paint is selected as the basecoat, and the white ZrO2 particles are evenly distributed on the specimen using high-pressure splashing method. Besides, to eliminate the radiation effect of the high-temperature specimen, the blue light source is used to illuminate the specimen, and the optical bandpass filter is placed in front of the camera to allow the blue light passing. In order to verify the DIC method, the strain measurement on a specimen with single skew hole is performed. The relative error in high temperature of the maximum strain between the measurement results and the numerical simulation results given by the finite element method (FEM) is 12%. The strain concentration factor of the single skew hole is measured as 1.83. Finally, the developed method is applied to the strain measurement of the structure with multiple film cooling holes in 870 degrees C. The X-shape strain distribution can be observed at the hole with maximum stress, which suggests that the strain field of multiple holes has coupling effect. In addition, the strain concentration factor of multiple film cooling holes increases to 2.34.