Microadditive Manufacturing Technologies of 3D Microelectromechanical Systems

被引:0
|
作者
Hassanin, Hany [1 ]
Sheikholeslami, Ghazal [1 ]
Sareh, Pooya [2 ]
Ishaq, Rihana B. [1 ]
机构
[1] Canterbury Christ Church Univ, Sch Engn Technol & Design, N Holmes Rd, Canterbury CT1 1QU, Kent, England
[2] Univ Liverpool, Creat Design Engn Lab Cdel, Sch Engn, Liverpool L69 3GH, Merseyside, England
关键词
additive manufacturing; microelectromechanical systems; microfabrication; rapid prototyping; 3D printing; ON-A-CHIP; ELECTROPHORETIC DEPOSITION; CERAMIC MICROCOMPONENTS; MICRO-STEREOLITHOGRAPHY; MICROFLUIDIC DEVICES; STRUCTURAL-CHANGES; SOFT LITHOGRAPHY; INDUCED STRESSES; SILICON-WAFERS; LASER;
D O I
10.1002/adem.202100422
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Conventional microfabrication processes have been well established, but their capabilities are generally limited simple and 2D extruded geometries. Additive manufacturing allows the ability to manufacture true 3D complex geometries, rapid design for manufacturing, mass customization, materials savings, and high precision, which have triggered the increased interest in manufacturing microelectromechanical systems (MEMS). Herein, MEMS manufacturing's recent advancements, including both conventional and additive manufacturing technologies, their working principles, and practical capabilities are consolidated. The use of additive manufacturing in several MEMS areas such as in microelectronics, circuitry, microfluidics, lab on a chip, packaging, and structural MEMS is also discussed in detail. Furthermore, the potentials and limitations of additive manufacturing are investigated with regard to the MEMS requirements. Finally, the technology outlook and improvements are discussed. This study shows that additive manufacturing offers a promising future for the fabrication of MEMS, especially using high-resolution techniques such as microstereolithography, materials jetting, and materials extrusion. In contrast, current challenges such as materials requirements, equipment innovation, fabricating of in vivo devices for biomedical applications, inherited defects and poor surface finish, adhesion to substrates, and productivity are areas that require further study to increase the uptake by the MEMS community.
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页数:22
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