Reduced-order models for MEMS applications

被引:248
|
作者
Nayfeh, AH
Younis, MI
Abdel-Rahman, EM
机构
[1] Virginia Polytech Inst & State Univ, Dept Engn Sci & Mech, Blacksburg, VA 24061 USA
[2] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA
关键词
MEMS; microbeams; microplates; reduced-order models; squeeze-film damping; thermoelastic damping;
D O I
10.1007/s11071-005-2809-9
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
We review the development of reduced-order models for MEMS devices. Based on their implementation procedures, we classify these reduced-order models into two broad categories: node and domain methods. Node methods use lower-order approximations of the system matrices found by evaluating the system equations at each node in the discretization mesh. Domain-based methods rely on modal analysis and the Galerkin method to rewrite the system equations in terms of domain-wide modes (eigenfunctions). We summarize the major contributions in the field and discuss the advantages and disadvantages of each implementation. We then present reduced-order models for microbeams and rectangular and circular microplates. Finally, we present reduced-order approaches to model squeeze-film and thermoelastic damping in MEMS and present analytical expressions for the damping coefficients. We validate these models by comparing their results with available theoretical and experimental results.
引用
收藏
页码:211 / 236
页数:26
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