Void growth in copper during high-temperature power-law creep

被引：31

作者：

Dzieciol, K. ^{[1
,2
]}

Borbely, A. ^{[1
,2
]}

Sket, F. ^{[3
,4
]}

Isaac, A. ^{[3
,5
]}

Di Michiel, M. ^{[6
]}

Cloetens, P. ^{[6
]}

Buslaps, Th ^{[6
]}

Pyzalla, A. R. ^{[3
]}

机构：

[1] Ecole Natl Super Mines, Ctr SMS, F-42023 St Etienne 2, France

[2] Max Planck Inst Eisenforsch GmbH, D-40237 Dusseldorf, Germany

[3] Helmholtz Zentrum Mat & Energie GmbH, D-14109 Berlin, Germany

[4] IMDEA Mat Inst, Madrid 28040, Spain

[5] Brazilian Synchrotron Light Lab, BR-13083970 Campinas, SP, Brazil

[6] European Synchrotron Radiat Facil, F-38043 Grenoble 9, France

来源：

ACTA MATERIALIA | 2011年 / 59卷 / 02期

关键词：

Creep test; Damage; Void growth; Synchrotron tomography; X-RAY TOMOGRAPHY; STEADY-STATE CREEP; METALS; MICROTOMOGRAPHY; FRACTURE; DAMAGE; CAVITATION; INITIATION; EVOLUTION; ALLOYS;

D O I：

10.1016/j.actamat.2010.10.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Growth of grain boundary voids during high-temperature power-law creep of metals is usually approximated as the growth of a hole in a nonlinearly viscous solid. Using synchrotron tomography, we show that the functional form of the continuum law is valid but that the real growth rates in copper are higher than the prediction of the viscous model by a factor of about 40. Submicrometer resolution tomography showing faceted void shapes as well as the large scatter of individual growth rates suggest that local dislocation glide has significative contribution to void growth. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：671 / 677

页数：7

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