Giant Pressure Output Efficiency of Capacitive Micromachined Ultrasonic Transducers Using Nano-Silicon-Springs

被引:1
|
作者
Kim, Hae Youn [1 ,2 ]
Kang, Dong-Hyun [1 ]
Shim, Shyinyong [1 ]
Seo, Jung-mok [2 ]
Khuri-Yakub, Butrus T. [3 ]
Lee, Byung Chul [1 ]
机构
[1] Korea Inst Sci & Technol, Bion Res Ctr, Seoul, South Korea
[2] Yonsei Univ, Dept Elect & Elect Engn, Seoul, South Korea
[3] Stanford Univ, Dept Elect Engn, Stanford, CA USA
基金
新加坡国家研究基金会;
关键词
capacitive micromachined ultrasonic transducer; pressure output efficiency; nano-silicon spring;
D O I
10.1109/IUS54386.2022.9958066
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
Although lead-free capacitive micromachined ultrasonic transducers (CMUTs) feature wide bandwidth and high resolution in medical imaging, the weak pressure output efficiency by the small average displacement of the top plate causes narrow imaging depth and high driving voltage, which blur the merits. This paper introduces a nano-silicon-spring-embedded CMUT that improves the transduction efficiency, achieving giant pressure output efficiency at lower voltage due to increasing the average displacement of the plate movement. With the proposed brand new CMUT, the corresponding maximum pressure output at the surface was 1.1 MPa, with 5-cycle pulses of 4.7 MHz and 5 V-PP. The great pressure output efficiency was achieved as 220 kPa/V. With this giant transduction efficiency and low voltage operation, future work is to implement a portable and wearable ultrasonic device with the nano-silicon-spring-embedded CMUT.
引用
收藏
页数:4
相关论文
共 50 条
  • [1] High-Efficiency Output Pressure Performance Using Capacitive Micromachined Ultrasonic Transducers with Substrate-Embedded Springs
    Lee, Byung Chul
    Nikoozadeh, Amin
    Park, Kwan Kyu
    Khuri-Yakub, Butrus T.
    SENSORS, 2018, 18 (08)
  • [2] Micromachined capacitive ultrasonic transducers fabricated using silicon on insulator wafers
    Cianci, E
    Foglietti, V
    Caliano, G
    Pappalardo, M
    MICROELECTRONIC ENGINEERING, 2002, 61-2 : 1025 - 1029
  • [3] An assessment of the thermal efficiency of capacitive micromachined ultrasonic transducers
    Ergun, A. Sanli
    Barnes, Stephen
    Gardner, Ed
    2007 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1-6, 2007, : 420 - 423
  • [4] Porous Silicon as Backing Material for Capacitive Micromachined Ultrasonic Transducers
    Lascaud, Julie
    Boulme, Audren
    Gross, Dominique
    Bahette, Emilie
    Defforge, Thomas
    Alquier, Daniel
    Gautier, Gael
    Certon, Dominique
    2016 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2016,
  • [5] Wafer-scale Fabrication of Nanometer Silicon Posts for Capacitive Micromachined Ultrasonic Transducers with Substrate-Embedded Springs
    Kim, Hae Youn
    Kang, Dong-Hyun
    Kim, Jinsik
    Khuri-Yakub, Butrus T.
    Lee, Byung Chul
    PROCEEDINGS OF THE 2020 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2020,
  • [6] Lamb wave devices using capacitive micromachined ultrasonic transducers
    Yaralioglu, GG
    Badi, MH
    Ergun, AS
    Cheng, CH
    Khuri-Yakub, BT
    Degertekin, FL
    APPLIED PHYSICS LETTERS, 2001, 78 (01) : 111 - 113
  • [7] SAFT imaging using immersed capacitive micromachined ultrasonic transducers
    McIntosh, JS
    Hutchins, DA
    Billson, DR
    Noble, RA
    Davies, RR
    Koker, L
    2002 IEEE ULTRASONICS SYMPOSIUM PROCEEDINGS, VOLS 1 AND 2, 2002, : 1019 - 1022
  • [8] Encapsulation of Capacitive Micromachined Ultrasonic Transducers Using Viscoelastic Polymer
    Lin, Der-Song
    Zhuang, Xuefeng
    Wong, Serena H.
    Kupnik, Mario
    Khuri-Yakub, Butrus Thomas
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2010, 19 (06) : 1341 - 1351
  • [9] Design of piezoelectric micromachined ultrasonic transducers (pMUTs) for high pressure output
    Wang, Mingjun
    Zhou, Yufeng
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017, 23 (06): : 1761 - 1766
  • [10] Design of piezoelectric micromachined ultrasonic transducers (pMUTs) for high pressure output
    Mingjun Wang
    Yufeng Zhou
    Microsystem Technologies, 2017, 23 : 1761 - 1766