CPW MMIC power amplifier design for flip-chip packaged power amplifiers

被引：0
|
作者：
Wong, A [1 ]
McAdoo, K [1 ]
Linton, D [1 ]
机构：
[1] Sch Elect & Elect Engn, Belfast, Antrim, North Ireland
来源：
2000 HIGH FREQUENCY POSTGRADUATE STUDENT COLLOQUIUM | 2000年
关键词：
D O I：
10.1109/HFPSC.2000.874078
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We will then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization.
引用
收藏
页码：32 / 37
页数：6
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