Influence of organic additive Thiourea on the properties of hard magnetic CoMnP thin film alloys electrodeposited from chloride bath

Thin films of CoMnP alloy have been deposited by electrodeposition technique on copper substrate with different concentration of NaH(2)PO(2) and Thiourea in the chemical bath to investigate the structural and magnetic properties of CoMnP compounds. The structural and surface morphology of the film were detected using X-ray diffractogram (XRD) and Scanning electron Microscope (SEM) respectively. The constitutions in the film were determined by Energy Dispersive X-Ray Spectroscopy (EDS) technique. The magnetic properties such as the coercivity and the magnetic saturation of the films were studied with the help of Vibrating Sample Magnetometer (VSM). The deposit were found to be smooth, nanocrystalline and with good adherence to the copper substrate. The increase in the NaH(2)PO(2) and Thiourea concentration in the bath causes a decrease in Mn content and increase in the P content of the film. Among the different compositions, CoMnP compound exhibit good hard magnetic properties, under the best condition involving addition of 0.2M of NaH(2)PO(2) and 2 gL(-1) of Thiourea at a current density of 7 mA-cm-(2) and time of deposition 60 minutes, the thickness of the film was found to be 3.3 micrometer with coercivity 1550 Oe and remanent 0.68 emu.