共 50 条
- [1] Design optimization of an integrated liquid-cooled IGBT power module using CFD technique [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 55 - 60
- [2] Heat Dissipation Simulation of Double-sided Liquid-cooled IGBT Module Package [J]. ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
- [4] Heat transfer characteristics of honeycomb liquid-cooled power battery module [J]. Huagong Xuebao/CIESC Journal, 2019, 70 (05): : 1713 - 1722
- [5] VLSI PACKAGING TECHNIQUE USING LIQUID-COOLED CHANNELS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1986, 9 (04): : 328 - 335
- [6] Power module integrated cooling design using CFD simulation [J]. CONFERENCE RECORD OF THE 2001 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2001, : 1925 - 1930
- [8] Placement Optimization of Liquid-Cooled Servers for Power Minimization in Data Centers [J]. 2014 INTERNATIONAL GREEN COMPUTING CONFERENCE (IGCC), 2014,
- [10] Thermal design and optimization of an IGBT power electronic module [J]. Electronic and Photonic Packaging, Integration and Packaging of MICRO/NANO/Electronic Systems, 2005, : 555 - 559