Design optimization of an integrated liquid-cooled IGBT power module using CFD technique

被引:9
|
作者
Lee, TYT [1 ]
机构
[1] Motorola Inc, Adv Interconnect Syst Labs, Tempe, AZ 85284 USA
关键词
IGBT; CFD; heat sink; thermal runaway; liquid cooling; power module;
D O I
10.1109/ITHERM.1998.689584
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents a novel approach to optimize pin array design of an integrated, liquid-cooled, Insulated Gate Bipolar Transistor (IGBT) power module. With the aid of a Computational Fluid Dynamics (CFD) code, the fluid field and heat transfer inside the module were analyzed, and several design options on pin arrays were examined. For IGBT die circuitry; the uniformity of temperature distribution among dies is as critical as the magnitude of the die temperature. A noticeable variation in temperature among dies can accelerate the thermal runaway and reduce the reliability of the devices. With geometrically-optimized-pin designs located both upstream and downstream of the channel, a total power dissipation of 1200 watts was achieved. The maximum junction temperature was maintained at similar to 100 degrees C and the maximum variation among dies was controlled within 1 degrees C. The results from this study indicated that the device junction temperatures were not only reduced in magnitude but were equalized as well. In addition, the maximum power dissipation of the module was enhanced. Comparison with other direct(pool boiling) and indirect- (cold plate) liquid cooling techniques was also discussed.
引用
收藏
页码:337 / 342
页数:6
相关论文
共 50 条
  • [1] Design optimization of an integrated liquid-cooled IGBT power module using CFD technique
    Lee, TY
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 55 - 60
  • [2] Heat Dissipation Simulation of Double-sided Liquid-cooled IGBT Module Package
    Xu, Yuan
    Bao, Jie
    Ning, Renxia
    Hou, Li
    Chen, Zhenhai
    Xu, Wenyi
    Zhou, Bin
    [J]. ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [3] LIQUID-COOLED POWER AMPLIFIER
    STEFANI, IL
    PERRYMAN, R
    [J]. WIRELESS WORLD, 1974, 80 (1468): : 505 - 507
  • [4] Heat transfer characteristics of honeycomb liquid-cooled power battery module
    Feng, Nenglian
    Ma, Ruijin
    Chen, Longke
    Dong, Shikang
    Wang, Xiaofeng
    Zhang, Xingyu
    [J]. Huagong Xuebao/CIESC Journal, 2019, 70 (05): : 1713 - 1722
  • [5] VLSI PACKAGING TECHNIQUE USING LIQUID-COOLED CHANNELS
    KISHIMOTO, T
    OHSAKI, T
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1986, 9 (04): : 328 - 335
  • [6] Power module integrated cooling design using CFD simulation
    Karim, O
    Schaeffer, C
    Mallet, B
    Coyaud, M
    Gimet, E
    [J]. CONFERENCE RECORD OF THE 2001 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-4, 2001, : 1925 - 1930
  • [7] LIQUID-COOLED POWER AMPLIFIER - REPLY
    PERRYMAN
    STEFANI
    [J]. WIRELESS WORLD, 1975, 81 (1473): : 220 - 221
  • [8] Placement Optimization of Liquid-Cooled Servers for Power Minimization in Data Centers
    Li, Li
    Zheng, Wenli
    Wang, Xiaodong
    Wang, Xiaorui
    [J]. 2014 INTERNATIONAL GREEN COMPUTING CONFERENCE (IGCC), 2014,
  • [9] LIQUID-COOLED POWER AMPLIFIER - COMMENT
    LENARTOWICZ, P
    [J]. WIRELESS WORLD, 1975, 81 (1473): : 220 - 220
  • [10] Thermal design and optimization of an IGBT power electronic module
    Mital, Manu
    Scott, Elaine P.
    [J]. Electronic and Photonic Packaging, Integration and Packaging of MICRO/NANO/Electronic Systems, 2005, : 555 - 559