Development of contact and wiring systems for high temperature sensor applications

被引：0
|
作者：
Gessner, T [1 ]
Kaufmann, C [1 ]
Hoffmann, R [1 ]
Gottfried, K [1 ]
Wiemer, M [1 ]
机构：
[1] Chemnitz Univ Technol, Fac Elect Engn & Informat Technol, Ctr Microtechnol, D-09107 Chemnitz, Germany
来源：
MICRO MATERIALS, PROCEEDINGS | 2000年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：196 / 197
页数：2
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