GaAs-based near-infrared up-conversion device fabricated by wafer fusion

被引:0
|
作者
Yang, Y. [1 ,2 ]
Liu, H. C. [1 ,2 ]
Shen, W. Z. [1 ]
Gupta, J. A. [2 ]
Luo, H. [2 ]
Buchanan, M. [2 ]
Wasilewski, Z. R. [2 ]
机构
[1] Shanghai Jiao Tong Univ, Key Lab Artificial Struct & Quantum Control, Dept Phys, Shanghai 200240, Peoples R China
[2] Natl Res Council Canada, Inst Microstruct Sci, Ottawa, ON K1A 0R6, Canada
关键词
D O I
10.1049/el.2010.3543
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Reported for the first time is a full GaAs-based room-temperature near-infrared (NIR) up-conversion device fabricated by wafer-fusing a GaNAsSb/GaAs pin photodetector (PD) with a GaAs/AlGaAs light-emitting diode (LED). NIR photons with wavelengths in the range 1.3-1.6 mu m were up-converted to 0.87 mu m.
引用
收藏
页码:393 / 394
页数:2
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