Suspension printing of liquid metal in yield-stress fluid for resilient 3D constructs with electromagnetic functions

被引:0
|
作者
Wu, Qian [1 ,2 ]
Zhu, Fengbo [3 ]
Wu, Ziliang [4 ]
Xie, Yu [5 ]
Qian, Jin [5 ]
Yin, Jun [1 ,2 ]
Yang, Huayong [1 ]
机构
[1] Zhejiang Univ, Sch Mech Engn, State Key Lab Fluid Power & Mechatron Syst, Hangzhou 310028, Peoples R China
[2] Zhejiang Univ, Sch Mech Engn, Key Lab 3D Printing Proc & Equipment Zhejiang Pro, Hangzhou 310028, Peoples R China
[3] Taiyuan Univ Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China
[4] Zhejiang Univ, Dept Polymer Sci & Engn, MOE Key Lab Macromol Synth & Functionalizat, Hangzhou 310027, Peoples R China
[5] Zhejiang Univ, Dept Engn Mech, Key Lab Soft Machines & Smart Devices Zhejiang Pr, Hangzhou 310027, Peoples R China
基金
中国国家自然科学基金;
关键词
GALLIUM-INDIUM ALLOY; STRAIN SENSORS; PREDICTION;
D O I
10.1038/541528-022-00184-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Liquid metal is an ideal conductive material for soft electronics because of its high conductivity and fluidity at room temperature. However, the large surface tension and high mass density of liquid metal make forming three-dimensional (3D) dangling structures a challenging task. Reported here is a suspension printing strategy for direct deposition of galinstan-based liquid metal into 3D dangling structures with high shape fidelity and spatial resolution (similar to 150 mu m). Acrylamide/nanoclay suspension served as a yield-stress fluid support bath, with selected hydrogen peroxide to immediately oxidize the gallium skin and strengthen the extruded liquid metal, thus continuous liquid metal filaments were deposited successfully. The subsequent photo-curing of acrylamide/nanoclay works as a resilient outer packaging, giving rise to a similar to 500% tensile deformation for liquid metal-hydrogel composite. This suspension printing strategy should broaden the opportunity of using 3D and functional liquid metal constructs for soft yet resilient electromagnetic devices.
引用
收藏
页数:11
相关论文
共 50 条
  • [1] Suspension printing of liquid metal in yield-stress fluid for resilient 3D constructs with electromagnetic functions
    Wu Q.
    Zhu F.
    Wu Z.
    Xie Y.
    Qian J.
    Yin J.
    Yang H.
    [J]. npj Flexible Electronics, 6 (1)
  • [2] 2.5D printing of a yield-stress fluid
    Colanges, Simon
    Tourvieille, Jean-Noel
    Lidon, Pierre
    Leng, Jacques
    [J]. SCIENTIFIC REPORTS, 2023, 13 (01)
  • [3] 2.5D printing of a yield-stress fluid
    Simon Colanges
    Jean-Noël Tourvieille
    Pierre Lidon
    Jacques Leng
    [J]. Scientific Reports, 13
  • [4] Suspension 3D Printing of Liquid Metal into Self-Healing Hydrogel
    Yu, Yongze
    Liu, Fujun
    Zhang, Renchang
    Liu, Jing
    [J]. ADVANCED MATERIALS TECHNOLOGIES, 2017, 2 (11):
  • [5] Coaxial Nozzle-Assisted Embedded 3D Printing of Single-Layered Channels Within a Yield-Stress Matrix Bath
    Raymond, Lily
    Hua, Weijian
    Valentin, Naima
    Coulter, Ryan
    Bandala, Erick
    Leong, Kaitlin
    Okaikoi, Jada
    Jin, Yifei
    [J]. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2024, 146 (01):
  • [6] 3D Printing of Free Standing Liquid Metal Microstructures
    Ladd, Collin
    So, Ju-Hee
    Muth, John
    Dickey, Michael D.
    [J]. ADVANCED MATERIALS, 2013, 25 (36) : 5081 - 5085
  • [7] Liquid Metal Direct Write and 3D Printing: A Review
    Neumann, Taylor V.
    Dickey, Michael D.
    [J]. ADVANCED MATERIALS TECHNOLOGIES, 2020, 5 (09)
  • [8] Enhancing the Yield Stress in Liquid Polydimethylsiloxane to Allow Its 3D Printing: Hydrogels as Removable Fillers
    Perrinet, Clement
    Courtial, Edwin-Joffrey
    Colly, Arthur
    Marquette, Christophe
    Fulchiron, Rene
    [J]. MACROMOLECULAR MATERIALS AND ENGINEERING, 2021, 306 (02)
  • [9] Hertzian stress analysis of metal and 3D printing materials
    Allamraju, K. Viswanath
    Srinivas, Ch Vaishnavi
    [J]. MATERIALS TODAY-PROCEEDINGS, 2022, 60 : 956 - 960
  • [10] Hertzian stress analysis of metal and 3D printing materials
    Viswanath Allamraju, K.
    Srinivas, Ch Vaishnavi
    [J]. Materials Today: Proceedings, 2022, 60 : 956 - 960