Three-dimensional failure analysis of high power semiconductor laser diodes operated in vacuum

被引:11
|
作者
Yeoh, Terence S. [1 ]
Chaney, John A. [1 ]
Leung, Martin S. [1 ]
Ives, Neil A. [1 ]
Feinberg, Z. D. [1 ]
Ho, James G. [2 ]
Wen, Jianguo [3 ]
机构
[1] Aerosp Corp, El Segundo, CA 90425 USA
[2] Northrop Grumman Space Technol, Redondo Beach, CA 90278 USA
[3] Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
关键词
D O I
10.1063/1.2821151
中图分类号
O59 [应用物理学];
学科分类号
摘要
The damaged region of a semiconductor laser diode that failed in a vacuum environment was analyzed using focused ion beam (FIB) serial sectioning, time-of-flight secondary ion mass spectrometry (ToF-SIMS), high resolution transmission electron microscopy (TEM), electron energy loss spectroscopy (EELS), energy dispersive x-ray spectroscopy (EDS), and nanodiffraction. The FIB nanotomography models and the TEM cross sections show a damage structure extending deep into the core and originating at the diode/antireflective (AR) coating interface. Nanocrystalline gold was detected at this interface using both TEM diffraction and EDS, and the localization of gold along the core at the diode/AR interface was corroborated using 3D ToF-SIMS. A thinning of the AR coating above the failure site was observed by TEM with a corresponding increase in carbon content on the AR surface detected with EELS. It is suggested that failure proceeded by pyrolysis of adsorbed hydrocarbons on the AR coating, which, in the presence of a high optical flux, contributed to carbothermal reduction of the AR coating. As the optical flux increased, thermal gradients facilitate metal migration, leading to larger gold clusters. These clusters are sites for deep level traps and may promote catalytic reactions. (c) 2007 American Institute of Physics.
引用
收藏
页数:7
相关论文
共 50 条
  • [1] High power semiconductor laser diodes
    Hanke, C
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2001, 31 (04): : 232 - 236
  • [2] Failure mode analysis of high-power laser diodes
    Ahrens, RG
    Jaques, JJ
    Dutta, NK
    LuValle, MJ
    Piccirilli, AB
    Camarda, RM
    Fields, AB
    Lawrence, KR
    TEST AND MEASUREMENT APPLICATIONS OF OPTOELECTRONIC DEVICES, 2002, 4648 : 30 - 42
  • [3] Three-dimensional thermal model of high-power semiconductor lasers
    Wu, Di-Hai
    Zah, Chung-En
    Liu, Xingsheng
    APPLIED OPTICS, 2019, 58 (14) : 3892 - 3901
  • [4] Three-dimensional modelling of high-power laser diodes based on the finite integration beam propagation method
    Niederhoff, M
    Heinrich, W
    Russer, P
    1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 1996, : 1429 - 1432
  • [5] Failure mechanisms in high power optical device packaging: Semiconductor laser diodes - A case study
    Dhamdhere, AR
    Malshe, AP
    Yedave, SN
    Schmidt, WF
    Brown, WD
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 212 - 217
  • [6] Three-dimensional flexible processing using high-power laser
    Chen, JM
    Wang, ZY
    Bao, Y
    Zuo, TC
    LASERS IN MATERIAL PROCESSING AND MANUFACTURING, 2002, 4915 : 285 - 288
  • [7] Three-dimensional packaging for power semiconductor devices and modules
    Calata, JN
    Bai, JG
    Liu, XS
    Wen, SH
    Lu, GQ
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (03): : 404 - 412
  • [8] Three-dimensional coupling structure for a high power laser diode module
    Tsai, Cheng-Mu
    Cheng, Ken-Yu
    Yeh, Chia-Hung
    Lin, Kuo-Wei
    Han, Pin
    OSA CONTINUUM, 2021, 4 (10): : 2655 - 2662
  • [9] Broad area, high power CW operated InGaN laser diodes
    Wisniewski, P.
    Czernecki, R.
    Prystawko, P.
    Maszkowicz, M.
    Leszczynski, M.
    Suski, T.
    Grzegory, I.
    Porowski, S.
    Marona, M.
    Swietlik, T.
    Perlin, P.
    NOVEL IN-PLANE SEMICONDUCTOR LASERS V, 2006, 6133
  • [10] High power and reliable semiconductor laser diodes for WDM applications
    Razeghi, M
    Slivken, S
    OPTOELECTRONIC INTEGRATED CIRCUITS VI, 2004, 5356 : 13 - 20