Laser assisted fabrication of copper traces on dielectrics by electroless plating

被引：7
|
作者：
Ratautas, Karolis [1 ]
Jagminiene, Aldona [1 ]
Stankeviciene, Ina [1 ]
Norkus, Eugenijus [1 ]
Raciukaitis, Gediminas [1 ]
机构：
[1] Ctr Phys Sci & Technol, Savanoriu Ave 231, LT-02300 Vilnius, Lithuania
来源：
10TH CIRP CONFERENCE ON PHOTONIC TECHNOLOGIES [LANE 2018] | 2018年 / 74卷
关键词：
selective; MID; electroless plating; circuit; plastic; laser;
D O I：
10.1016/j.procir.2018.08.144
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A new technology for circuit traces production: Selective Surface Activation Induced by Laser (SSAIL) enables to fabricate fine metallic structure on dielectric materials polymers and glass. S SAIL contains three main steps: The first step is surface modification by laser, second chemical activation of modified areas and the last step is metal deposition by electroless plating. A Picosecond laser was used for writing. The method has been investigated in detail for wide window of laser processing parameters. Sheet resistance measurement of finally plated sample and laser processed surface roughness measurement were carried out. This new technique can reduce production cost of circuit traces for molded interconnect devices. (C) 2018 The Authors. Published by Elsevier Ltd.
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页码：367 / 370
页数：4
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