Thermal management of microelectronics in the 21st century

被引：10
|
作者：
Bar-Cohen, A [1 ]
机构：
[1] Univ Minnesota, Dept Mech Engn, Lab Thermal Management Elect, Minneapolis, MN 55455 USA
来源：
PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE | 1997年
关键词：
D O I：
10.1109/EPTC.1997.723880
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the 21(st) century. Thermal packaging efforts must, thus, be performed in the context of the salient trends and parameters that characterize the IC technology and the electronic products industry. Enhanced, air-cooled Heat Sinks and Passive Immersion Modules are two quite distinct thermal packaging technologies that may play a pivotal role in future electronic systems.
引用
收藏
页码：29 / 33
页数：5
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