Fabrication of transparent capacitive structure by self-assembled thin films

被引:3
|
作者
Zhang, Q. [1 ]
Shin, Y. J. [1 ]
Hua, F. [1 ]
Saraf, L. V. [2 ]
Matson, D. W. [2 ]
机构
[1] Clarkson Univ, Dept Elect & Comp Engn, Potsdam, NY 13699 USA
[2] Pacific NW Natl Lab, Richland, WA 99352 USA
关键词
electrostatic self-assembly; nanoparticle; transparent electronics; flexible electronics;
D O I
10.1166/jnn.2008.075
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
An approach to fabricating transparent electronic devices by using nanomaterial and nanofabrication is presented in this paper. A see-through capacitor is constructed from self-assembled silica nanoparticle layers that are stacked on the transparent substrate. The electrodes are made of indium tin oxide. Unlike the traditional processes used to fabricate such devices, the self-assembly approach enables one to synthesize the thin film layers at lower temperature and cost, and with a broader availability of nanomaterials. The vertical dimension of the self-assembled thin films can be precisely controlled, as well as the molecular order in the thin film layers. The shape of the capacitor is generated by planar micropatterning. The monitoring by quartz crystal demonstrates the steady growth of the silica nanoparticle multilayer. In addition, because the material synthesis and the device fabrication steps are separate, the fabrication is not affected by the harsh conditions required for the material synthesis. As a result, a clear pattern is allowed over a large area on the substrate. The prepared capacitive structure has an optical transparency higher than 92% over the visible spectrum. The capacitive impedance is measured at different frequencies and fit the theoretical results. As one of the fundamental components, this type of capacitive structure can serve in the transparent circuits, interactive media and sensors, as well as being applicable to other transparent devices.
引用
收藏
页码:3008 / 3012
页数:5
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