MID in the automotive industry - Potentials, benefits and applications

被引：6

作者：

Feldmann, K ^{[1
]}

Pohlau, F ^{[1
]}

机构：

[1] Univ Erlangen Nurnberg, Inst Mfg Automat & Prod Syst, D-8520 Erlangen, Germany

来源：

TWENTY SECOND IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, IEMT-EUROPE 1998: ELECTRONICS MANUFACTURING AND DEVELOPMENT FOR AUTOMOTIVES | 1998年

关键词：

D O I：

10.1109/IEMTE.1998.723063

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Molded Interconnect Device (MID) technology integrates electrical and mechanical functions into a single molded part. A variety of methods is available for manufacturing MIDs. Depending on the application, the use of MID technology allows more than 20% in cost saving over conventional technologies as proven by several examples. MID boast a wide field of applications in an automobile and have been sucessfully used in several cases.

引用

页码：76 / 81

页数：6

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