共 50 条
- [3] Photonics IC Packaging Investigation based on 3D Printing Approach 2024 LATIN AMERICAN WORKSHOP ON OPTICAL FIBER SENSORS, LAWOFS 2024, 2024,
- [4] 3D printing as a new packaging approach for MEMS and Electronic devices 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1071 - 1079
- [6] A new microsystem packaging approach Using 3D printing encapsulation process 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 118 - 124
- [7] Strategy in 3D Printing of Food 2018 PORTLAND INTERNATIONAL CONFERENCE ON MANAGEMENT OF ENGINEERING AND TECHNOLOGY (PICMET '18): MANAGING TECHNOLOGICAL ENTREPRENEURSHIP: THE ENGINE FOR ECONOMIC GROWTH, 2018,