Novel On-Chip Through-Silicon-Via Wilkinson Power Divider

被引：0

作者：

Woods, Wayne ^{[1
]}

Ding, Hanyi ^{[1
]}

Wang, Guoan ^{[1
]}

Joseph, Alvin ^{[1
]}

机构：

[1] IBM Semicond Res & Dev, Essex Jct, VT 05452 USA

来源：

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2010年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

On-chip Wilkinson power dividers are used in MMW circuit designs such as phased array antenna systems. This paper presents a novel on-chip MMW Through-Silicon-Via (TSV) Wilkinson power divider. HFSS simulations of the TSV Wilkinson power divider in a 130 nm BiCMOS technology revealed insertion loss per lambda/4 "arm" of 0.9 dB at 60 GHz with both return loss and isolation better than 18 dB at 60 GHz and good matching in both signal phase and amplitude at the two outputs.

引用

页码：537 / 542

页数：6

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