A compact MU interface 2.5-Gb/s optical transmitter module with an embedded LD-driver IC

被引:5
|
作者
Ishitsuka, F [1 ]
Iwasaki, N [1 ]
Hirose, M [1 ]
Yanagibashi, M [1 ]
Ichino, H [1 ]
Ando, Y [1 ]
机构
[1] Nippon Telegraph & Tel Corp, Optoelect Labs, Musashino, Tokyo 1800012, Japan
关键词
D O I
10.1109/ECTC.1998.678691
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A compact MU interface 3.5-Gb/s optical transmitter module is described. It employs a low power consumption LD-driver IC (LD-DR) which is thermally isolated from the 1.55-mu m DFB-LD attached on a TE-cooler. The optical connector interface is an MU receptacle positioned at the opposite side of the electrical miniature coaxial receptacles The high coupling method of a DFB-LD to a single mode fiber is used. It consists of two aspheric lenses which are positioned under a confocal condition. The module using the proposed configuration has been evaluated from 10 degrees C to 65 degrees C. Good results of high coupling efficiency over 50%, low dissipation power less than 1.8 W (LD-DR only dissipated 0.33 W), and electrical performance at the speed of 2.5 Gb/s have been obtained with the 6.2-cc module. This compact module with low consumption will be useful for highly integrated on-board equipment required for large-capacity systems such as future SDH and WDM systems.
引用
收藏
页码:184 / 191
页数:8
相关论文
共 15 条
  • [1] A compact MU-interface, 2,5-Gb/s optical transmitter module with LD-driver IC embedded in L-shaped wiring substrate
    Ishitsuka, F
    Iwasaki, N
    Hirose, M
    Yanagibashi, M
    Ichino, H
    Ando, Y
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (03): : 451 - 459
  • [2] 10 GBIT/S OPTICAL TRANSMITTER MODULE WITH MQW DFB-LD AND DMT DRIVER IC
    SUZAKI, T
    SUZUKI, Y
    YAMADA, H
    FUJITA, S
    HIDA, H
    KITAMURA, M
    SHIKADA, M
    ELECTRONICS LETTERS, 1990, 26 (02) : 151 - 152
  • [3] An ultracompact, 2-cc-size, low-power 2.5-Gb/s optical receiver module incorporating an MU receptacle
    Hirose, M
    Ishihara, N
    Akazawa, Y
    Ichino, H
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1999, 17 (11) : 2349 - 2355
  • [4] 2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications
    Ukaegbu, Ikechi Augustine
    Kim, Do-Won
    Cho, Mu Hee
    Lee, Tae-Woo
    Park, Hyo-Hoon
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2011, 23 (19) : 1403 - 1405
  • [5] A low-power & low-noise 2.5-Gb/s optical receiver IC in 0.35μm CMOS
    Jalali, M
    Zarifkar, A
    Emami, A
    Soroosh, M
    2004 IEEE International Conference on Semiconductor Electronics, Proceedings, 2004, : 168 - 170
  • [6] A 50-Gb/s modulated Optical Transmitter based on a DFB-LD and a 0.18-μm SiGe BiCMOS LD Driver
    Takemoto, Takashi
    Matsuoka, Yasunobu
    Sugiyama, Yoshikazu
    Yonezawa, Hidenori
    Yamashita, Hiroki
    Adachi, Koichiro
    Nakamura, Takahiro
    Nomoto, Etsuko
    Nakahara, Kouji
    Arimoto, Hideo
    Osada, Kenichi
    Ido, Tatemi
    2015 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2015,
  • [7] A 50-Gb/s Optical Transmitter Based on a 25-Gb/s-Class DFB-LD and a 0.18-μm SiGe BiCMOS LD Driver
    Takemoto, Takashi
    Matsuoka, Yasunobu
    Yamashita, Hiroki
    Nakamura, Takahiro
    Lee, Yong
    Arimoto, Hideo
    Ido, Tatemi
    IEICE TRANSACTIONS ON ELECTRONICS, 2016, E99C (09): : 1039 - 1047
  • [8] Burst-mode optical transmitter with DC-coupled burst-enable signal for 2.5-Gb/s GPON system
    Park, Sang Hyun
    Karppinen, Mikko
    Le, Quan
    Yoon, Bin Young
    MICROELECTRONICS JOURNAL, 2008, 39 (01) : 112 - 116
  • [9] Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface
    Iwasaki, N
    Yanagibashi, M
    Tsunetsugu, H
    Kato, K
    Ishitsuka, F
    Hosoya, M
    Kikuchi, H
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (04): : 429 - 433
  • [10] Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface
    Iwasaki, N
    Yanagibashi, M
    Tsunetsugu, H
    Kato, K
    Ishitsuka, F
    Hosoya, M
    Kikuchi, H
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 474 - 478