Factors influencing the electroless gold plating for ceramic packaging

被引：0
|
作者：
Zhang, Lei [1 ]
Liu, Sheng-Qian [1 ]
Liu, Qiao-Ming [1 ]
机构：
[1] Hebei Semicond Res Inst, Shijiazhuang 050051, Peoples R China
来源：
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Electroless gold plating is. a perfect gold plating method for high-density ceramic packaging. Compared with electroplating of gold, it has remarkable advantages. However, the solution of electroless gold plating is unstable, the control of gold layer thickness is not easy, so the electroless gold plating is not easily widely applied. In the article, the factors influencing the process of electroless gold plating have been researched, and application discussed by a series of experimentation.
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页码：463 / 465
页数：3
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