Microreplicated Pad Conditioner for Copper and Copper Barrier CMP Applications

被引：0

作者：

Tseng, Wei-Tsu ^{[1
]}

Rafie, Sana ^{[1
]}

Ticknor, Adam ^{[1
]}

Devarapalli, Vamsi ^{[1
]}

Rill, Elliott ^{[1
]}

Economikos, Laertis ^{[1
]}

Zabasajja, John ^{[2
]}

Sokol, Jennifer ^{[2
]}

Laraia, Vince ^{[2
]}

Fritz, Matt ^{[2
]}

机构：

[1] IBM Semicond R&D Ctr, 2070 Rt 52, Hopewell Jct, NY 12533 USA

[2] 3M Elect Mat Solut Div, St Paul, MN 55144 USA

来源：

2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT) | 2014年

关键词：

Cu CMP; pad conditioning; microreplication;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Metal-free micro-replicated conditioning disks are applied to the development of Cu and Cu barrier CMP processes for 22nm technology nodes. Compared with traditional pad conditioners with diamond grits embedded in metal matrix, the micro-replicated conditioners demonstrate lower within-wafer non-uniformity, more stable end-point time, more uniform and controllable pad wear, lower defectivity, and longer pad life time. Used pad analyses provide insights into the effectiveness of conditioning and guidelines for further process improvement.

引用

页码：152 / 157

页数：6

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