Buckling and fracture of thin films under compression

The energy release rate when thin films on compliant substrates delaminate and buckle with or without cracking is shown to be much greater than if the substrate is stiff. For very compliant substrates relative to the film, such as indium tin oxide on polyethylene terephthalate the energy release rate can be more than an order of magnitude greater than the value obtained if the deformation of the substrate is neglected. The mode-mixity is also less on compliant substrates than on stiff ones.