Numerical study on the influence of electron temperature on void formation in dusty plasma

被引:4
|
作者
Wang, Yan [1 ]
Zhu, Xu [2 ]
Chen, Zhaoyang [1 ]
Huang, Feng [3 ]
机构
[1] Beijing Univ Chem Technol, Coll Math & Phys, Beijing 100029, Peoples R China
[2] Beijing NAURA Microelect Equipment Co Ltd, PVD Business Unit, Beijing 100176, Peoples R China
[3] China Agr Univ, Coll Sci, Beijing 100083, Peoples R China
基金
中国国家自然科学基金;
关键词
void; electron temperature; fluid simulation; dusty plasma; INSTABILITIES;
D O I
10.1088/1402-4896/ab784f
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
In the past, experiments have proven that the electron temperature in the void is lower than that in the dust cloud. Based on this point, the influence of the spatial distribution of the electron temperature on the void is studied by calculating the fluid equation with explicit ionization, and the images of the circular void and the ring void are obtained by simulation. It is found that when the electron temperature is greater than the threshold value, a stable circular void is generated, and as the electron temperature increases, the time required for the circular void to reach a steady state decreases and its size decreases. This law is not affected by electron temperature spatial distribution set in the center. Combined with the studies of circular void, we speculate that the electron temperature in the ring void is also lower than that in the dust cloud. Through the assumption of the spatial distribution of electron temperature, the simulation results in a ring-shaped void. And the influence of the intensity of the spatial variation of the electron temperature on the ring void is verified. The results show that when the electron temperature change is severe enough, a ring void is generated. And as the intensity increases, the time required for the ring void to reach a steady state decreases, and the size increases slightly.
引用
收藏
页数:10
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