The mechanical properties of epoxy resin composites modified by compound modification

被引:13
|
作者
Li, Cuiyu [1 ,2 ]
Zhang, Rui [1 ]
Wang, Gaopan [1 ]
Shi, Yameng [1 ]
机构
[1] Tianjin Polytech Univ, Sch Text, Tianjin 300387, Peoples R China
[2] Tianjin Polytech Univ, Key Lab Adv Text Composites, Minist Educ, Tianjin 300387, Peoples R China
基金
中国国家自然科学基金;
关键词
NANOPARTICLES;
D O I
10.1063/1.5047083
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The composite modification is a method of modifying the surface of ultra high molecular weight polyethylene (UHMWPE) fabric through the surface grafting, at the same time the epoxy resin through ultrasonic and 3-amino propyl triethoxy silane (KH550), and then using the vacuum assisted resin transfer molding (VARTM) process to prepare the composite. Explore the improvement of the interface between fiber and resin so as to optimize the mechanical properties of the material. The modification effect, the mechanism of action and the effect of different KH550 contents on the properties of the composite were studied. Compared with the unmodified sample, When 1wt% KH550, the maximum tensile load, tensile strength and the tensile fracture length increased by 13.83%, 20.19% and 51.27%, respectively, and the tensile modulus was reduced by 29.74%. The maximum bending stress and bending modulus of the 1wt% KH550 sample were increased by 104.57% and 190.97%, respectively. The displacement, which is related to the maximum loading, the pressure and the tension area of the resin decreased by 7.81%. The KH550 content had a substantial influence on the thermal decomposition temperature of UHMWPE, and it had a small effect on the epoxy resin. A KH550 content of 1wt% strengthened the bonds between the fibre and the resin, such that the main failure mode of the pressure area was the hickies, and the tension areas contained hickies and cracks. (c) 2018 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
引用
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页数:15
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