Epoxy composites with ceramic core-shell fillers for thermal management in electrical devices

被引:27
|
作者
Rybak, Andrzej [1 ]
Gaska, Karolina [2 ]
Kapusta, Czeslaw [2 ]
Toche, Francois [3 ]
Salles, Vincent [3 ]
机构
[1] ABB Corp Res Ctr, Starowislna 13A, PL-31038 Krakow, Poland
[2] AGH Univ Sci & Technol, Dept Solid State Phys, Fac Phys & Appl Comp Sci, Mickiewicza 30, PL-30059 Krakow, Poland
[3] Univ Lyon 1, UMR 5615, CNRS, Lab Multimat & Interfaces, 43 Bd 11 Novembre 1918, F-69622 Villeurbanne, France
关键词
functional composite; core-shell filler; thermal management; thermal conductivity; POLYMER COMPOSITES; BORON-NITRIDE; CONDUCTIVITY ENHANCEMENT; HEAT-CONDUCTIVITY; LOW-TEMPERATURES; MATRIX; SILSESQUIOXANES; PARTICLES; PRECURSOR; HYBRIDS;
D O I
10.1002/pat.4038
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In this work, a novel core-shell material has been manufactured in order to enhance the thermal conductivity of epoxy-based composites. The polymer derived ceramics technique has been used to produce fillers whose core is composed of a standard material - silica, and whose outer layer consists of a boron nitride or silicon nitride shell. The synthesized filler was characterized by infrared spectroscopy, X-ray diffraction, and scanning electron microscopy coupled with an energy dispersive spectroscopy analysis. The successful formation of core-shell structure was proven. Composite samples based on an epoxy resin filled with 31vol% of synthetized core-shell filler have been investigated in order to determine the effective thermal conductivity of the modified system. The resulting core-shell composite samples exhibited improvements in thermal conductivity of almost 30% in relation to standard systems, making them a promising material for heat management applications. Additionally, the temperature dependence of the thermal conductivity was investigated over a broad temperature range indicating that the thermal behavior of the composite with incorporated core-shell filler is stable. This stability is a crucial factor when considering the potential of using this technology in applications such as electronics and power systems. Copyright (c) 2017 John Wiley & Sons, Ltd.
引用
收藏
页码:1676 / 1682
页数:7
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