Ceramic CSP - The characteristics and the advantages

With industrial acceptance of Ceramic CSP, Multilayer ceramic package is now being recognized to offer effective means in terms of achieving significant size reduction, thickness reduction and cost reduction. Now CSP packages are advancing into production status with various options such as, material type, and process technology, in which only the advantages me presented causing some confusion at user side. Therefore, it is necessary for packaging engineers to organize the merit and demerits for individual package technology to give a more clear view to users to take advantage of CSP concept. This paper describes ceramic CSP in terms of multilayer ceramic technology, reliability and optimized array assembly technology.