Building of silicon sensors by micromachining of bulk silicon and anodic bonding

This paper gives a review of wet etching of silicon and anodic bonding. These processes form together with micropatterning on both sides of wafers and dry etching a highly flexible technology for production of silicon sensors. To demonstrate the strength of these proven technologies, several examples of feasible, low cost, highly reliable sensors are presented. These technologies are used for manufacturing of a variety of application specific sensors and microsystems and are now mature enough to be used for customer designed solutions.