Enhanced Thermal Properties of Silicone Composites with Hexagonal Boron Nitride

被引:0
|
作者
Khanum, Khadija Kanwal [1 ]
Jayaram, Shesha [1 ]
机构
[1] Univ Waterloo, Dept Elect & Comp Engn, Waterloo, ON, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
Composites; dielectric materials; electronic packaging thermal management; silicone insulators; thermal analysis; thermal management of electronics; POLYMER COMPOSITES; CONDUCTIVITY;
D O I
10.1109/IAS44978.2020.9334915
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, silicone rubber an electrically insulating material is filled with, nanofiller; hexagonal boron nitride (h-BN) and micro-silica in three varying concentrations. The micro-silica is industrially preferred and widely used filler, whereas; h-BN is expensive and preferred for specialty applications. The fillers are added to silicone rubber using an electrostatic disperser which aids in homogenizing the filler-polymer mixture by means of shearing force along with elongation. The dispersion of fillers in the silicone matrix is studied using scanning electron microscope. The performance of synthesized silicone composites are evaluated using tensile strength, percent elongation at break, and erosion.
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页数:4
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