High Aspect Ratio TGV Fabrication Using Photosensitive Glass Substrate

被引：0

作者：

Zhao, Xudong ^{[1
,2
]}

Pi, Yudan ^{[2
]}

Wang, Wei ^{[2
,3
]}

Ma, Shenglin ^{[4
]}

Jin, Yufeng ^{[1
,2
,3
]}

机构：

[1] Peking Univ, Shenzhen Grad Sch, Sch Elect & Comp Engn, Shenzhen 518055, Guangdong, Peoples R China

[2] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China

[3] Natl Key Lab Sci & Technol Micro Nano Fabricat, Beijing 100871, Peoples R China

[4] Xiamen Univ, Dept Mech & Elect Engn, Xiamen 361005, Fujian, Peoples R China

来源：

2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) | 2018年

基金：

中国国家自然科学基金;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Compared with Si, glass has been regarded as a promising material for RF application because of its excellent electrical properties. The use of glass for RF applications has been proposed and developed for several years. However, because of the fabrication limitation, it's not easy to fabricate high aspect ratio through glass vias (TGVs). In this paper, TGVs with different shapes and sizes were fabricated with the photosensitive glass substrate which can be well structured, with a maximum aspect ratio of 11. The formation of TGVs on a 500-mu m thick glass substrate was realized by wet etching in less than 15 minutes after thermal treatment.

引用

下载

页码：90 / 92

页数：3

共 50 条

[1] Formation and Metallization Process Study on High Aspect Ratio Through-Glass-Via (TGV) Within Photosensitive Glass
Lin L.-C.
Wang Q.-D.
Qiu D.-L.
Wu H.
Xue K.
Yu D.-Q.
Cao L.-Q.
2018, Beijing Institute of Technology (38): : 52 - 57
[2] High aspect-ratio microchip-based capillary electrophoresis device using chemically machinable photosensitive glass substrate
Fujimura, T
Etoh, S
Ishikawa, S
Ikeda, A
Hattori, R
Kuroki, Y
MICROPROCESSES AND NANOTECHNOLOGY 2000, DIGEST OF PAPERS, 2000, : 68 - 69
[3] Superconformal Filling of High Aspect Ratio through Glass Vias (TGV) for Interposer Applications Using TNBT and NTBC Additives
Ogutu, Paul
Fey, Edmond
Dimitrov, Nikolay
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2015, 162 (09) : D457 - D464
[4] Fabrication of high aspect ratio metallic microstructures on ITO glass substrate using reverse-side exposure of SU-8
Lu, Chunhua
Yin, Xuefeng
Wang, Min
SENSORS AND ACTUATORS A-PHYSICAL, 2007, 136 (01) : 412 - 416
[5] High Performance IPDs (Integrated Passive Devices) and TGV (Through Glass Via) Interposer Technology using the Photosensitive Glass
Yook, Jong-Min
Kim, Dongsu
Kim, Jun Chul
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 41 - 46
[6] Fabrication of metal micro-grating with high aspect ratio on metal substrate
Du, Li-Qun
Bao, Qi-Lei
Zhao, Ming
Wang, Ao-An
Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2015, 23 (03): : 700 - 707
[7] Fabrication of high aspect ratio micro electrode by using EDM
Elsiti, Nagwa Mejid
Noordin, M. Y.
Alkali, Adam Umar
2ND INTERNATIONAL MANUFACTURING ENGINEERING CONFERENCE AND 3RD ASIA-PACIFIC CONFERENCE ON MANUFACTURING SYSTEMS (IMEC-APCOMS 2015), 2016, 114
[8] Fabrication of microlens arrays by using photosensitive glass
Luo, Fengguang
Cao, Mingcui
Li, Hongpu
Ai, Jun
Xu, Jun
Guangxue Jishu/Optical Technique, 1994, (03): : 19 - 20
[9] Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias
Lee, Min-Kai
Yu, Jyun-Zong
Chang, Hsin-Yu
Chang, Chia-Yuan
Liu, Chien-Sheng
Lin, Pai-Chen
AIP ADVANCES, 2022, 12 (05)
[10] High-aspect micro-wingwheels in photosensitive glass
Gimkiewicz, C
Gerhard, E
MICROSYSTEM TECHNOLOGIES, 1997, 4 (01) : 40 - 45

← 1 2 3 4 5 →