Study of Joule Heating Effects in Lead-Free Solder Joints under Electromigration

被引：0

作者：

Xu, Guangchen ^{[1
]}

Guo, Fu ^{[1
]}

Lee, Andre ^{[2
]}

Subramanian, K. N. ^{[2
]}

Wright, Neil ^{[3
]}

机构：

[1] Beijing Univ Technol, Coll Mat Sci & Engn, Beijing, Peoples R China

[2] Michigan State Univ, Dept Chem Engn & Mat Sci, E Lansing, MI 48824 USA

[3] Michigan State Univ, Dept Mech Engn, E Lansing, MI 48824 USA

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

基金：

北京市自然科学基金; 中国国家自然科学基金;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Basic understanding of heating conduction in lead-free solder joints due to the Joule heating effect was carried out by using the infrared (IR) microscopy. In order to interpret the corresponding mechanism and provide a better understanding to Electromigration (EM) studies, a newly developed ID solder joint with same cross-sectional area in solder alloy and Cu electrodes was employed in our thermal imaging analysis. Both eutectic SnBi and SnAgCu solder alloy were used to fabricate the joints due to their distinct electrical resistivity and thermal conductivity. Various electrical current inputs combined with joints' thickness of 500 urn were investigated. Accordingly, transient and steady-state heat conduction were identified and compared with different experimental conditions.

引用

页码：464 / 467

页数：4

共 50 条

[1] Electromigration issues in lead-free solder joints
Chih Chen
S. W. Liang
[J]. Journal of Materials Science: Materials in Electronics, 2007, 18 : 259 - 268
[2] Electromigration issues in lead-free solder joints
Chen, Chih
Liang, S. W.
[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 259 - 268
[3] Modeling Microstructure Effects on Electromigration in Lead-free Solder Joints
Ni, Jiamin
Liu, Yong
Hao, Jifa
Maniatty, Antoinette
O'Connell, Barry
[J]. 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1241 - 1246
[4] Effects of Joule Heating on the Impact Behavior of Lead-free Sn-based Solder Joints
Liu, Sihan
Liu, Fang
Li, Zhe
Xu, Guangchen
Guo, Fu
[J]. 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 652 - 656
[5] Effects of graphene oxide on the electromigration lifetime of lead-free solder joints
Ko, Yong-Ho
Son, Kirak
Kim, Gahui
Park, Young-Bae
Yu, Dong-Yurl
Bang, Junghwan
Kim, Taek-Soo
[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (03) : 2334 - 2341
[6] The effects of thermal cycling on electromigration behaviors in lead-free solder joints
Yong, Zuo
Ma, Limin
Yue, Lu
Liu, Sihan
Guo, Fu
[J]. 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1068 - 1071
[7] Effects of graphene oxide on the electromigration lifetime of lead-free solder joints
Yong-Ho Ko
Kirak Son
Gahui Kim
Young-Bae Park
Dong-Yurl Yu
Junghwan Bang
Taek-Soo Kim
[J]. Journal of Materials Science: Materials in Electronics, 2019, 30 : 2334 - 2341
[8] Electromigration Induced Stress in Lead-Free Solder Joints
Ni, Jiamin
Maniatty, Antoinette
Liu, Yong
Hao, Jifa
Ring, Matt
[J]. 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 538 - 543
[9] Effects of joule heating on the electromigration properties of eutectic SnBi solder joints
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100022, China
[J]. Pan Tao Ti Hsueh Pao, 2008, 10 (2023-2026):
[10] Electromigration in lead-free solder joints on ceramic PCB substrates
Straubinger, Daniel
Rigler, Daniel
Geczy, Attila
Synkiewicz-Musialska, Beata
[J]. 2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 52 - 56

← 1 2 3 4 5 →