Computational Modeling Demonstrates the Joint Clearance Effect on the Tensile Strength of Solder Joints

被引：0
|
作者：
Vianco, Paul T. [1 ]
Neilsen, Michael K. [1 ]
机构：
[1] Sandia Natl Labs, POB 5800, Albuquerque, NM 87185 USA
来源：
WELDING JOURNAL | 2021年 / 100卷 / 09期
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暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
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页码：46 / 49
页数：4
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