Finite Element Modeling of Fowler-Nordheim Program-Erase Process in High-k Interpoly Dielectric Flash Memories

被引:6
|
作者
Mahajan, Ashutosh [1 ,2 ]
Gawhane, Dhiraj [1 ,3 ]
Patrikar, Rajendra [1 ]
机构
[1] Visvesvaraya Natl Inst Technol, VLSI & Nanotechnol Ctr, Nagpur 440010, Maharashtra, India
[2] Indian Inst Technol, Bombay 400076, Maharashtra, India
[3] KLA Tencor Corp, Madras 600096, Tamil Nadu, India
关键词
High-k gate dielectrics; semiconductor device modeling; semiconductor memory; SIMULATION;
D O I
10.1109/TED.2016.2616370
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The program/erase process in floating gate (FG) flash memory devices is modeled by considering sequential quantum tunneling of electrons and taking into account quantum confinement in the channel and FG. We precisely determine location of quasi-bound or decaying quantum states in the inversion layer and in FG comprising a nanocrystal (NC) layer, and compute their lifetime by finding the complex eigenenergy of the resonance transmission problem. Self-consistent solutions to Poisson and Schrodinger equations are obtained for the quantum states of electrons in the inversion layer of MOS devices, and subsequently, sequential Fowler-Nordheim tunneling current to the spherical NCs is obtained using finite-element method considering open boundary conditions. The method described here is capable of determining the tunneling current accurately for arbitrary potential profiles, and can be applied for composite tunnel dielectric stacks. Our results show good agreement with the experimental data for high-k interpoly dielectric flash memory devices.
引用
收藏
页码:4729 / 4736
页数:8
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