High germanium content SiGe virtual substrates grown at high temperatures

被引:40
|
作者
Bogumilowicz, Y
Hartmann, JM
Laugier, F
Rolland, G
Billon, T
Cherkashin, N
Claverie, A
机构
[1] STMicroelect, F-38921 Crolles, France
[2] CEA GRE, CEA DRT, LETI, D2NT, F-38054 Grenoble, France
[3] CEA GRE, DPTS, F-38054 Grenoble, France
[4] CNRS, CEMES, Nmat Grp, F-31055 Toulouse, France
关键词
cross-hatch; strain relaxation; threading dislocations; virtual substrates; reduced pressure-chemical vapour deposition; SiGe;
D O I
10.1016/j.jcrysgro.2005.06.036
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We have grown high Ge content SiGe virtual substrates at high temperatures in a reduced pressure-chemical vapour deposition reactor. We have notably focused on the effects of growth temperature and final germanium content on the virtual substrates' structural properties (macroscopic degree of strain relaxation, surface roughness and threading dislocation densities). Increasing the growth temperature of Si0.80Ge0.20 virtual substrates leads to a severe reduction of both the field and pile-up threading dislocation densities, while keeping a relatively smooth cross-hatched surface. A growth temperature of 950 degrees C allows one to achieve a 10(5) cm(-2) (10(4) cm(-2)) field (pile-up) threading dislocations density. For a fixed growth temperature, increasing the germanium content of virtual substrates leads to an increase of the surface roughness that is more severe at 900 than at 850 degrees C. The final Ge content (between 20% and 50%) has little impact on the field threading dislocation density, whereas it does increase the pile-up threading dislocation density. Such an increase seems to be influenced by the surface roughness. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:346 / 355
页数:10
相关论文
共 50 条
  • [1] High-temperature growth of very high germanium content SiGe virtual substrates
    Bogumilowicz, Y
    Hartmann, JM
    Di Nardo, C
    Holliger, P
    Papon, AM
    Rolland, G
    Billon, T
    [J]. JOURNAL OF CRYSTAL GROWTH, 2006, 290 (02) : 523 - 531
  • [2] High germanium content strained SGOI by oxidation of amorphous SiGe film on SOI substrates
    Gao, F
    Balakumar, S
    Balasubramanian, N
    Lee, SJ
    Tung, CH
    Kumar, R
    Sudhiranjan, T
    Foo, YL
    Kwong, DL
    [J]. ELECTROCHEMICAL AND SOLID STATE LETTERS, 2005, 8 (12) : G337 - G340
  • [3] Reverse graded relaxed buffers for high Ge content SiGe virtual substrates
    Shah, V. A.
    Dobbie, A.
    Myronov, M.
    Fulgoni, D. J. F.
    Nash, L. J.
    Leadley, D. R.
    [J]. APPLIED PHYSICS LETTERS, 2008, 93 (19)
  • [4] SiGe HBTs with very high germanium content in the base
    Gruhle, A
    Schuppen, A
    Kibbel, H
    Konig, U
    [J]. COMPOUND SEMICONDUCTORS 1995, 1996, 145 : 679 - 682
  • [5] High-germanium-content SiGe islands formed on compliant oxide by SiGe oxidation
    Yin, HZ
    Hobart, KD
    Kub, FJ
    Shieh, SR
    Duffy, TS
    Sturm, JC
    [J]. APPLIED PHYSICS LETTERS, 2004, 84 (18) : 3624 - 3626
  • [6] Defects in SiGe virtual substrates for high mobility electron gas
    Di Gaspare, L
    Fiorini, P
    Scappucci, G
    Evangelisti, F
    Palange, E
    [J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2001, 80 (1-3): : 36 - 40
  • [7] Terrace grading of SiGe for high-quality virtual substrates
    Capewell, AD
    Grasby, TJ
    Whall, TE
    Parker, EHC
    [J]. APPLIED PHYSICS LETTERS, 2002, 81 (25) : 4775 - 4777
  • [8] HEMTs on LEPECVD-grown virtual SiGe substrates
    Hackbarth, Thomas
    Von Känel, Hans
    [J]. III-Vs Review, 2002, 15 (01) : 48 - 51
  • [9] Reduced pressure - Chemical vapor deposition of high Ge content (20%-55%) SiGe virtual substrates
    Bogumilowicz, Y
    Hartmann, JM
    Laugier, F
    Rolland, G
    Billon, T
    Renard, V
    Olshanetsky, EB
    Estibals, O
    Kvon, ZD
    Portal, JC
    [J]. HIGH-MOBILITY GROUP-IV MATERIALS AND DEVICES, 2004, 809 : 45 - 50
  • [10] Relaxed SiGe layers with high Ge content by compliant substrates
    Yin, H
    Peterson, RL
    Hobart, KD
    Shieh, SR
    Duffy, TS
    Sturm, JC
    [J]. COMOS FRONT-END MATERIALS AND PROCESS TECHNOLOGY, 2003, 765 : 147 - 151