Effects of mixed abrasives in chemical mechanical polishing of oxide films

Thermal oxide covered silicon wafers were polished with slurries containing (i) only nano-sized particles of ceria, monodispersed colloidal spherical silica, or hematite of different shapes, (ii) a binary mixture of the same nano-sized and uniform colloidal particles, and (iii) the same colloids coated with nano-sized ceria. The procedures for the preparation of the coated particles are described in this article. The polish rates and surface qualities were in all cases higher with mixed slurries, and even more so with coated particles. The performance of composite systems also depended on the shape of the particles, cubic ones being the most and spheres least efficient. Experimental results indicated that ceria in mixtures was responsible for the enhanced polish process, while core materials enhanced a closer contact of nano-sized particles with the wafer. In general, the polish rates were higher with the larger contact area between the abrasives and the wafer. This mechanism was further verified by polishing oxide wafers on 3-M fixed abrasive pads, which have cylindrical structures with flat surfaces.