Fabrication of atomic-scale gold junctions by electrochemical plating using a common medical liquid

被引:24
|
作者
Umeno, A [1 ]
Hirakawa, K [1 ]
机构
[1] Univ Tokyo, Inst Ind Sci, Meguro Ku, Tokyo 1538505, Japan
基金
日本学术振兴会;
关键词
D O I
10.1063/1.1897444
中图分类号
O59 [应用物理学];
学科分类号
摘要
Fabrication of nanometer-separated gold junctions has been performed using "iodine tincture," a medical liquid known as a disinfectant, as an etching/deposition electrolyte. In the gold-dissolved iodine tincture, gold electrodes were grown or eroded slowly enough to form quantum point contacts in an atomic scale. The resistance evolution during the electrochemical deposition showed plateaus at integer multiples of the resistance quantum, (2e(2)/h)(-1), at room temperature (e: the elementary charge, h: the Planck constant). Iodine tincture is a commercially available common material, which makes the fabrication process to be simple and cost effective. Moreover, in contrast to the conventional electrochemical approaches, this method is free from highly toxic cyanide compounds or extraordinarily strong acids. (C) 2005 American Institute of Physics.
引用
收藏
页码:1 / 3
页数:3
相关论文
共 50 条
  • [1] Fabrication of atomic-scale gold junctions by electrochemical plating technique using a common medical disinfectant
    Umeno, A
    Hirakawa, K
    [J]. Physics of Semiconductors, Pts A and B, 2005, 772 : 1071 - 1072
  • [2] Electrochemical Fabrication of Gold Quantum Wire with Atomic-Scale
    Dong, Xiaodong
    Liu, Junhua
    [J]. ASIAN JOURNAL OF CHEMISTRY, 2013, 25 (05) : 2641 - 2643
  • [3] Simultaneous fabrication of nanogap gold electrodes by electroless gold plating using a common medical liquid
    Yasutake, Yuhsuke
    Kono, Keijiro
    Kanehara, Masayuki
    Teranishi, Toshiharu
    Buitelaar, Mark R.
    Smith, Charles G.
    Majima, Yutaka
    [J]. APPLIED PHYSICS LETTERS, 2007, 91 (20)
  • [4] Heat dissipation in atomic-scale junctions
    Woochul Lee
    Kyeongtae Kim
    Wonho Jeong
    Linda Angela Zotti
    Fabian Pauly
    Juan Carlos Cuevas
    Pramod Reddy
    [J]. Nature, 2013, 498 : 209 - 212
  • [5] Heat dissipation in atomic-scale junctions
    Lee, Woochul
    Kim, Kyeongtae
    Jeong, Wonho
    Angela Zotti, Linda
    Pauly, Fabian
    Carlos Cuevas, Juan
    Reddy, Pramod
    [J]. NATURE, 2013, 498 (7453) : 209 - +
  • [6] Process investigation of the electrochemical fabrication of Au tunnel junction with atomic-scale
    Dong, Xiao-Dong
    Zhang, Bai-Lin
    Xia, Yong
    Zhu, Guo-Yi
    [J]. Gaodeng Xuexiao Huaxue Xuebao/Chemical Journal of Chinese Universities, 2008, 29 (07): : 1424 - 1427
  • [7] Process investigation of the electrochemical fabrication of Au tunnel junction with atomic-scale
    Dong Xiao-Dong
    Zhang Bai-Lin
    Xia Yong
    Zhu Guo-Yi
    [J]. CHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE, 2008, 29 (07): : 1424 - 1427
  • [8] Quantitative Bond Energetics in Atomic-Scale Junctions
    Aradhya, Sriharsha V.
    Nielsen, Aileen
    Hybertsen, Mark S.
    Venkataraman, Latha
    [J]. ACS NANO, 2014, 8 (07) : 7522 - 7530
  • [9] Atomic-scale silicon device fabrication
    Simmons, M. Y.
    Ruess, F. J.
    Goh, K. E. J.
    Pok, W.
    Hallam, T.
    Butcher, M. J.
    Reusch, T. C. G.
    Scappucci, G.
    [J]. INTERNATIONAL JOURNAL OF NANOTECHNOLOGY, 2008, 5 (2-3) : 352 - 369
  • [10] Fabrication of electron beam deposited tip for atomic-scale atomic force microscopy in liquid
    Miyazawa, K.
    Izumi, H.
    Watanabe-Nakayama, T.
    Asakawa, H.
    Fukuma, T.
    [J]. NANOTECHNOLOGY, 2015, 26 (10)