Applications of Hybrid III-V on Silicon Devices in Optical Fiber Networks

被引：0
|
作者：
de Valicourt, G. [1 ]
Accard, A. [2 ]
Kaspar, P. [2 ]
Lelarge, Francois [2 ]
Levaufre, G. [2 ]
Girard, N. [2 ]
Le Liepvre, A. [2 ]
Make, D. [2 ]
Olivier, S. [2 ]
Malhouitre, S. [2 ]
Duan, G. -H. [2 ]
机构：
[1] Alcatel Lucent, Bell Labs, 791 Holmdel Rd, Holmdel, NJ 07733 USA
[2] Joint Lab Alcatel Lucent Bell Labs France Thales, Lab 3 4, F-91767 Palaiseau, France
来源：
2015 OPTO-ELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC) | 2015年
关键词：
Fiber optics communications; Integrated optics devices; Lasers; tunable;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent progress on hybrid integration of III-V on Silicon devices using wafer bonding is presented focusing on hybrid tunable lasers and their applications for the next generation of access, metropolitan and long haul optical networks.
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页数：3
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