Polymer substrates for flexible electronics: achievements and challenges

被引:33
|
作者
Yakimets, Iryna [1 ]
MacKerron, Duncan [2 ]
Giesen, Peter [1 ]
Kilmartin, Keith J. [2 ]
Goorhuis, Marloes [1 ]
Meinders, Erwin [1 ]
MacDonald, William A. [2 ]
机构
[1] TNO, Holst Ctr, Lithog Flexible Substrates, High Tech Campus 31,POB 8550, NL-5605 NL Eindhoven, Netherlands
[2] DuPont Teijin Films UK Ltd, Middlesbrough, Cleveland TS90 8JF, England
来源
关键词
coefficient of thermal expansion; refractive index; dimensional stability;
D O I
10.4028/www.scientific.net/AMR.93-94.5
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Flexible electronics technology can potentially result in many compelling applications not satisfied by the rigid Si-based conventional electronics. Commercially available foils such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) have emerged as the most suitable polymer materials for wide range of flexible electronics applications. Despite the enormous progress which has been recently done on the optimization of physical and mechanical properties of PET and PEN foils, their dimensional stability at the micro-scale is still an issue during patterning of wiring by means of lithography. Consequently, the measurement of in-plane micro-deformation of foil is of great importance for understanding and predicting its thermal, hydroscopic and mechanical behaviour during processing.
引用
收藏
页码:5 / +
页数:2
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