Asymmetrically recessed 50-nm gate-length metamorphic high electron-mobility transistor with enhanced gain performance

被引:6
|
作者
Xu, Dong [1 ]
Kong, Wendell M. T. [1 ]
Yang, Xiaoping [1 ]
Sn-Tith, P. M. [1 ]
Dugas, D. [1 ]
Chao, P. C. [1 ]
Cueva, G. [1 ]
Mohnkern, L. [1 ]
Seekell, P. [1 ]
Pleasant, L. Mt. [1 ]
Schmanski, B. [1 ]
Duh, K. H. G. [1 ]
Karimy, H. [1 ]
InTmorlica, A. [1 ]
Komiak, J. J. [1 ]
机构
[1] BAE Syst, Microelect Technol & Prod, Elect & Integrated Solut, Nashua, NH 03060 USA
关键词
electron beam lithography; high electron-mobility transistors (HEMTs); maximum stable gain (MSG); metamorphic HEMTs (MHEMTs); MODFETs; submillimeter wave FETs;
D O I
10.1109/LED.2007.910787
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report the design, fabrication and characterization of ultrahigh gain metamorphic high electron-mobility transistors. In this letter, a high-yield 50-nm T-gate process was successfully developed and applied to epitaxial layers containing high indium mole fraction InGaAs channels grown on GaAs substrates. A unique gate recess process was adopted to significantly increase device gain by effectively suppressing output conductance and feedback capacitance. Coupled with extremely small 10 mu m x 25 mu m via holes on substrates thinned to 1 mil, we achieved a 13.5 dB maximum stable gain (MSG) at 110 GHz for a 30-mu m gate-width device. To our knowledge, this is the highest gain performance reported for microwave high electron-mobility transistor devices of similar gate periphery at this frequency, and equivalent circuit modeling indicates that this device will operate at frequencies beyond 300 GHz.
引用
收藏
页码:4 / 7
页数:4
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