SCPA Transformer Based Matching Network Design Flow and SiP Implementation

被引：0
|
作者：
Eldeeb, Abdelhamed [1 ]
Batistell, Graciele [1 ,2 ]
Boesch, Wolfgang [2 ]
Sturm, Johannes [1 ]
机构：
[1] CUAS, Josef Ressel Ctr Integrated CMOS RF Syst & Circui, Villach, Austria
[2] Graz Univ Technol, Inst Microwave & Photon Engn, Graz, Austria
来源：
2018 26TH AUSTROCHIP WORKSHOP ON MICROELECTRONICS (AUSTROCHIP) | 2018年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the analysis, design, and layout of a transformer based Matching Network (MN) implemented on a System in Package (SiP) with focus on area reduction. The effects of MN Insertion Loss (IL) and input impedance on the Switched Capacitor Power Amplifier (SCPA) efficiency are analyzed. The MN is investigated based on a circuit level model. Furthermore, the design flow of an IL- and area-optimized MN is proposed. Finally, the SiP MN transformer layout is realized using a 3 metal layer core-less package substrate. Two MNs are designed for center frequencies of 1.7 GHz and 0.8 GHz with insertion losses of 1.2 dB, and 1.4 dB, a total layout area of 0.43 mm(2) and 0.46 mm(2) respectively.
引用
收藏
页码：22 / 26
页数：5
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