Investigation of lateral spreading current in the 4H-SiC Schottky barrier diode chip

被引:4
|
作者
Wang, Xi [1 ,2 ]
Zhong, Yiwen [1 ]
Pu, Hongbin [1 ,2 ]
Hu, Jichao [1 ,2 ]
Feng, Xianfeng [1 ,2 ]
Yang, Guowen [3 ]
机构
[1] Xian Univ Technol, Dept Elect Engn, Xian 710048, Peoples R China
[2] Xian Key Lab Power Elect Devices & High Efficienc, Xian 710048, Peoples R China
[3] Sanli Intelligent Elect Co Ltd, Xian 712000, Peoples R China
基金
中国国家自然科学基金;
关键词
4H-SiC; Schottky barrier diode; lateral spreading current;
D O I
10.1088/1674-4926/42/11/112802
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Lateral current spreading in the 4H-SiC Schottky barrier diode (SBD) chip is investigated. The 4H-SiC SBD chips with the same vertical parameters are simulated and fabricated. The results indicate that there is a fixed spreading resistance at on-state in current spreading region for a specific chip. The linear specific spreading resistance at the on-state is calculated to be 8.6 omega/cm in the fabricated chips. The proportion of the lateral spreading current in total forward current (P (sp)) is related to anode voltage and the chip area. P (sp) is increased with the increase in the anode voltage during initial on-state and then tends to a stable value. The stable values of P (sp) of the two fabricated chips are 32% and 54%. Combined with theoretical analysis, the proportion of the terminal region and scribing trench in a whole chip (K (sp)) is also calculated and compared with P (sp). The K (sp) values of the two fabricated chips are calculated to be 31.94% and 57.75%. The values of K (sp) and P (sp) are close with each other in a specific chip. The calculated K (sp) can be used to predict that when the chip area of SiC SBD becomes larger than 0.5 cm(2), the value of P (sp) would be lower than 10%.
引用
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页数:6
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