Analysis of Undercut for SS304 in Photochemical Machining

被引：0
|
作者：
Yadav, S. [1 ]
Saraf, A. [1 ]
Sadaiah, M. [1 ]
机构：
[1] Dr Babasaheb Ambedkar Technol Univ, Lonere, Raigad, India
来源：
PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON COMMUNICATION AND SIGNAL PROCESSING 2016 (ICCASP 2016) | 2017年 / 137卷
关键词：
photochemical machining; undercut; SS304; ANOVA; DoE; CHLORIDE;
D O I：
暂无
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
Undercut plays a crucial role in the industry of photochemical machining technology. This paper inspects the effect of undercut on the process parameter in Photochemical Machining (PCM) of SS304. A full factorial (3(3)) Design of Experiments (DoE) were performed consisting of twenty-seven experimental runs. The concentration of etchant, temperature and time of etching were assumed to be the control parameters whereas the undercut (Uc) was considered to be the response parameter. Analysis of Variance (ANOVA) technique was used to analyze the effect of control parameters on undercut and thus the evaluation of its optimal conditions were performed. The experimental investigations revealed that the temperature of etchant and time of etching are the most substantial factors affecting the undercut.
引用
收藏
页码：284 / 289
页数：6
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