Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement

被引：4
|
作者：
Ni, Tianming [1 ]
Bian, Jingchang [2 ]
Yang, Zhao [2 ]
Nie, Mu [1 ]
Yao, Liang [2 ]
Huang, Zhengfeng [2 ]
Yan, Aibin [3 ]
Wen, Xiaoqing [4 ]
机构：
[1] Anhui Polytech Univ, Coll Elect Engn, Wuhu 241000, Peoples R China
[2] Hefei Univ Technol, Sch Microelect, Hefei 230601, Peoples R China
[3] Anhui Univ, Sch Comp Sci & Technol, Hefei 230039, Peoples R China
[4] Kyushu Inst Technol, Grad Sch Comp Sci & Syst Engn, Dept Creat Informat, Fukuoka 8208502, Japan
来源：
IEEE DESIGN & TEST | 2022年 / 39卷 / 05期
基金：
中国国家自然科学基金;
关键词：
Through-silicon vias; Reliability; Three-dimensional displays; Integrated circuits; Fault tolerant systems; Failure analysis; Circuit faults; 3D ICs; through-silicon-via (TSV); lifetime reliability; fault tolerance; time division multiplexing access (TDMA); THROUGH-SILICON; REPAIR;
D O I：
10.1109/MDAT.2022.3189827
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Editor's notes: Through-silicon via (TSV) failure can occur due to various reliability issues. In this article, an interesting broadcast time-division multiplexing-access (TDMA) mechanism is used as a cost-effective fault-tolerance method for TSV yield improvement and lifetime enhancement. -Hailong Jiao, Peking University
引用
收藏
页码：34 / 42
页数：9
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