Investigation of Heat Transfer in 3D Packaging for Practical-scale Quantum Annealing Machines

被引：1

作者：

Feng, Wei ^{[1
]}

Kikuchi, Katsuya ^{[1
]}

Hidaka, Mutsuo ^{[1
]}

Yamamori, Hirotake ^{[1
]}

Araga, Yuuki ^{[1
]}

Makise, Kazumasa ^{[2
]}

Kawabata, Shiro ^{[2
]}

机构：

[1] Natl Inst Adv Ind Sci & Technol, Device Technol Res Inst, Tsukuba, Ibaraki 3058568, Japan

[2] Natl Inst Adv Ind Sci & Technol, Res Ctr Emerging Comp Technol RCECT, Tsukuba, Ibaraki 3058568, Japan

来源：

2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021) | 2021年

关键词：

quantum annealing; three-dimensional (3D) integrated technologies; heat transfer; Finite Element Method (FEM) simulation;

D O I：

10.23919/ICEP51988.2021.9451978

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A Qubit-chip/Interposer/Package substrate (QUIP) structure based on the 3D packaging technology is proposed to realize scalable quantum annealing machines. We investigate the thermal conduction of the QUIP structure with finite element method. The effect of the TSV diameter and number, the thickness of interposer and substrate, and the pitch of bumps on thermal conduction is discussed. We reveal the reduction of the maximum temperature of the qubit chips from 40.2 mK to 18.8 mK by optimizing the heat transfer to the heat sink. A cryogenic environment at 20 mK level is successfully achieved for qubit chip operation in QUIP structure.

引用

页码：163 / 164

页数：2

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