Densification of carbon nanotube bundles for interconnect application

被引：29
|
作者：
Liu, Z. [1 ]
Bajwa, N. [1 ]
Ci, L. [1 ]
Lee, S. H. [1 ]
Kar, S. [1 ]
Ajayan, P. M. [1 ]
Lu, J. -Q. [1 ]
机构：
[1] Rensselaer Polytech Inst, Ctr Integrated Elect, 110 8th St, Troy, NY 12180 USA
来源：
PROCEEDINGS OF THE IEEE 2007 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE | 2007年
关键词：
D O I：
10.1109/IITC.2007.382389
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
We demonstrated a post-growth processing method to increase the site density of carbon nanotube (CNT) bundles, a critical step towards CNT interconnect for use in future ICs. CVD-grown CNT bundles are immersed in an organic solvent, then withdrawn from the liquid bath by solvent evaporation, and consequently compacted. The CNT site density is increased 5 similar to 25 times. Influences of bundle structure parameters on densification are discussed and the interconnect implementation of densified CNTs is presented.
引用
收藏
页码：201 / +
页数：2
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